Nihon Superior to Introduce the Newest Addition to the SN100C Lead-Free Solder Series at SMTAI 2011

1st November 2011
Posted By : ES Admin
Nihon Superior to Introduce the Newest Addition to the SN100C Lead-Free Solder Series at SMTAI 2011

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will introduce the newest addition to its SN100C lead-free solder series in Booth #310 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.

SN100C (551CT), the newest addition to the SN100C lead-free solder series, combines the benefits of a high-reliability alloy (Sn-0.7Cu-0.05Ni+Ge) with a sustained activity core flux. The 551CT core flux is formulated for use with soldering tip temperatures up to 380°C while still retaining sufficient activity to ensure good tip separation. Compared with previous formulations, icicling is reduced by 90 percent and spattering by 95 percent. The silver-free SN100C alloy has a stable microstructure that can accommodate both the long-term cyclic strain and the impact loading to which solder joints can be subjected in service.

SN100C (551CT) has been developed specifically for sequential soldering and rework. Today, 12 years after its introduction, SN100C lead-free solder is still displacing SAC305 in many applications because of its high reliability, low copper erosion and cost effectiveness.

Nihon Superior also will display several next-generation products that are completely halogen-free. It has high activity despite no intentional additions of the halogens F, Cl, Br or I.

SN100C P602 D4 features excellent reflow with good wetting and minimum incidence of mid-chip balling, low residue and significant cost advantages. Additionally, it typically can be reflowed with a profile similar to that which is commonly used with SAC305 and SAC405 with 240°C peak.

The SN100C fillets are smooth and bright with few shrinkage defects and a stable microstructure with minimal growth of the interfacial intermetallic, resulting in highly reliable solder joints.

SN100C P603 D4 and SN100C P605 D6 are designed as high-reliability solder pastes for superior dispensing stability that ensures no missed joints. SN100C P603 D4 is for 0402 (1005 metric) chip components, and SN100C P605 D6 is for 01005 (0402 metric) chip components. Additionally, it typically can be reflowed with a profile similar to that which is commonly used with SAC305 and SAC405 with 240°C peak.

SN100C (044) is a halogen-free high-reliability no-clean flux-cored lead-free solder wire that does not contain F, Cl, Br or I. This wire provides the fast wetting and spread, which makes it possible to complete a solder joint up to 30 percent faster than with previously available completely halogen-free flux-cored wire. Additionally, use of the solder wire results in reduced cracking of flux residue, fewer shrinkage defects, reduced copper erosion, cost advantages and a stable intermetallic layer.


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