Nihon Superior Highlights Copper Erosion Differences between Low-Ag and No-Ag Lead-Free Solders
Nihon Superior Co., Ltd has highlighted the greater effectiveness of the nickel addition in its unique SN100C lead-free solder in limiting copper erosion during soldering processes. Nihon Superior has been prompted to draw attention to this fact by the claims and counterclaims that have been made for various low- and no-silver lead-free solders currently offered in the market.
The micrographs below are from a study undertaken by the University of Queensland to compare the copper erosion characteristics of various lead-free solder formulations. The fluxed copper/OSP test boards were exposed to the solders for five seconds in a mini-wave machine with a pot temperature of 255°C. The thickness of the copper remaining on the board soldered with Sn-0.7Cu-0.05Ni was approximately twice that remaining after soldering Sn-0.7Cu with additions of 0.3Ag and 0.3Ag+0.1Bi.
The Sn-0.7Cu-0.05Ni is the basis for Nihon Superior’s SN100C® solder that also incorporates a Ge addition as an antioxidant and flow promoter.
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