Indium expert presenting at PCIM and SMT Hybrid Packaging
Presenting at PCIM Europe 2017 and at SMT Hybrid Packaging on 16th May in Nuremberg, Germany, is the Regional Technical Manager of Indium Corporation, Andreas Karch, in charge of Germany, Austria and Switzerland. Karch will present ‘Performance of Current Flux Systems in Solder Pastes to Increase the Electrical Reliability of Assemblies.’
He will discuss solder paste flux systems, solder paste performance, and the addition of solder volume for pin-in-paste using Solder Fortification preforms.
Karch provides support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials, including solder paste, solder preforms, fluxes, and thermal management materials.
Karch has more than 20 years of automotive industry experience, including the advanced development of customised electronics. He is an ECQA-certified integrated design engineer and has a Six Sigma Yellow Belt.
The Austrian Patent Office also selected him as one of the 2014 recipients of the Top 10 Inventum Awards for an automotive LED assembly. Karch maintains a thorough understanding of process technologies and project management skills.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets.
Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil.
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