Design

Flomerics announced today that the Package Engineering Group from Applied Micro Circuits Corporation is using Flotherm thermal simulation software to significantly reduce the cost of packaging and the project resource cost for a new family of ICs. AMCC achieved these outstanding results by comparing flip-chip and wire bond thermal performance early in the design process.

Adept Scientific plc announces the latest edition of Maplesoft’s™ ground breaking engineering software with an extensive new feature set.

Flomerics Ltd. today announced the availability of version 8.2 of its popular Engineering Fluid Dynamics (EFD) fluid flow and thermal simulation product family.

CCE, has announced that EnSuite Version 2 – its multi-CAD viewing, translation and productivity software – has been upgraded to support point cloud files. EnSuite Version 2 can be used to import point cloud files in .xyz and .csv files that are typically produced on a coordinate measuring machine (CMM), laser scanner, or other inspection equipment.

When migrating to Windchill® PDMLink® or Windchill® INTRALINK® from Pro/INTRALINK® 3.X there may be issues that need to be resolved. Removing metadata and model configuration as issues can help minimize these problems. The MCU is used to clean up, consolidate and standardize Pro/ENGINEER parameters, layers, and family tables.

iCADsales.com is offering a free full evaluation download running for 30 days of progeCAD 2008 Professional version 8.0.18, offering increased speed and reliability.

Flomerics has published a comprehensive technical white paper on mesh generation techniques for fluid flow simulation. Written for mechanical engineers, the paper explains the need for a computational mesh and the pros and cons of different mesh types. It also explains the factors affecting the choice of grid system such as cell shape, geometry representation, mesh structure and grid generation.

Thermacore used Flomerics’ Flotherm thermal simulation software to solve a challenging thermal management problem in a tower mounted amplifier (TMA) for a cellular base station. Thermal simulation showed that the heat from the 1 by 1.5 inch amplifier chips did not spread out sufficiently to utilize the full extent of the heat sink, causing the chips to overheat. The problem was addressed by adding a vapor chamber to each chip to reduce the spreading resistance and utilize the full extent of the heatsink. The simulation showed this approach reduced the temperature at the base of the heat sink to acceptable levels.

Lattice Technology, developers of the XVL suite of 3D publishing applications, today announced that XVL Player Version 9, is now available for free download at www.lattice3D.com.

ExperTune has received a patent for its novel wizard builder technology. The patent was issued April 8, 2008. The wizard builder creates connection wizards for communication between process controllers (DCS's and PLC's) and PC based software. In a way, it is a wizard that builds wizards. PlantTriage performance supervision software uses this wizard technology.