The completion of previously announced joint venture between Qualcomm Incorporated and TDK Corporation has been announced under the name RF360 Holidjngs Singapore PTE. The joint venture will enable Qualcomm’s RFFE Business Unit to deliver RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), automotive applications and connected computing.
The business being transferred constitutes a part of the TDK SAW Business Group activities.
Cristiano Amon, Executive Vice President, Qualcomm Technologies, and President, QCT said: “The ongoing expansion of mobile communication across multiple industries, and the unprecedented deployment of multi-carrier 4G technologies now reaching over 65 3GPP frequency bands are driving manufacturers of wireless solutions to higher levels of miniaturisation, integration and performance, especially for the RFFE in these devices.”
Amon continued: “Further, 5G will increase the level of complexity even more. To that end, the ability to provide the ecosystem a truly complete solution is essential to enabling our customers to deliver mobile solutions at scale and on time.”
Together with RF360 Holdings, Qualcomm Technologies, (QTI) will be positioned to design and supply products with end-to-end performance and global scale from the modem/transceiver all the way to the antenna in a fully integrated system.
RF360 Holdings will have a comprehensive set of filters and filter technologies, including Surface Acoustic Wave (SAW), Temperature-Compensated Surface Acoustic Wave (TC-SAW) and Bulk Acoustic Wave (BAW), to support the wide range of frequency bands being deployed in networks across the globe. Moreover, RF360 Holdings will enable the delivery of RFFE modules from QTI that will include front-end components designed and developed by QTI.
These components include CMOS, SOI and GaAs Power Amplifiers, a broad portfolio of Switches, Antenna Tuning, Low Noise Amplifiers (LNAs) and the Envelope Tracking solution.
Deepening collaboration between Qualcomm and TDK
In addition to operating the joint venture, Qualcomm and TDK will deepen their technological cooperation to cover a wide range of technologies for next-generation mobile communications, IoT and automotive applications.
“The deeper collaboration with Qualcomm fits perfectly into our growth strategy,” said Shigenao Ishiguro, President and CEO of TDK Corporation. “It is a further step that aims to open up new promising business opportunities for TDK, while strengthening the company's innovativeness and thus competitiveness in such attractive future markets as sensors, MEMS, wireless charging and batteries. Our customers will clearly benefit from the resulting unique and comprehensive technologies and products portfolio.”
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