Telsonic UK Limited to Showcase New Technologies and Concepts at PDM 2010

The Telsonic stand at this year’s event will feature a number of different items from the company’s extensive range of ultrasonic components and systems. The USP750P is a robust, fully integrated yet compact ultrasonic welding system which can be applied to a host of welding and joining applications. This unit will be operational at PDM 2010 and Telsonic representatives will be happy to demonstrate this system to visitors to the stand.

Other equipment on show will include a hand held ultrasonic welding system which offers a cost effective and flexible solution to many applications. This lightweight handgun, weighing only 1Kg, is powered by a 1000W generator.

Application samples of the Ultrasonic process’s unique ability to Cut’n’seal textiles, fabrics and non wovens will also be on display. Since last year’s PDM show, Telsonic has launched a new Packaging Technology Division and examples of new concepts for packaging applications, such as Cross Sealing and Fin Sealing will also be available for review. Telsonic will also showcase their Torsional Welding Technique – SoniqTwist® – which allows delicate products such as thin film membranes or electronic components to be joined or welded without the risk of damage. SoniqTwist® can also be applied to welding applications on the “peelable” foil lids, often used on plastic or coated aluminium pots. A wide range of sample parts, including some processed using these techniques, will be displayed on the Telsonic stand.

Telsonic UK Limited can be located on stand J30, and company representatives will be happy to discuss customer applications and offer advice on the use and integration of Telsonic’s comprehensive range of ultrasonic technology.