The Telsonic stand at this year’s event will feature a number of modules and concepts, including new ultrasonic innovations, which are targeted specifically at sealing applications on flexible and rigid packaging. A key feature on the Telsonic stand this year is a demonstration of longitudinal Fin Sealing on packaging using Telsonic’s new torsional ultrasonic head principals. The equipment on show is equally suited to integration within VFFS or HFFS systems. The features, flexibility and reliability of the process, present benefits in a wide range of packaging and sealing applications. Other concepts on display will include:-
• VFFS & HFFS cross sealing modules using multi converter systems
• Torsional welding of peelable foil lids to plastic or coated aluminium pots
• Cross sealing modules for rotary VFFS machines
• Multi-converter cross sealing for linear or rotary (impeller) applications for SUP.(stand up pouches)
Telsonic UK Limited can be located on stand G12, and company representatives will be happy to discuss customer applications and offer advice on the use and integration of Telsonic’s ultrasonic technology for all types of packaging, sealing and machine integration projects.