Telsonic Showcase New Ultrasonic Packaging Technology at Total Processing & Packaging 2010

11th March 2010
Posted By : ES Admin
Telsonic Showcase New Ultrasonic Packaging Technology at Total Processing & Packaging 2010
Telsonic has been present within the UK market since 1977. Since then, the comprehensive range of high quality ultrasonic products available from the company has enabled Telsonic to build up a strong and diverse UK customer base. Telsonic UK Limited will further consolidate this position with their participation at the Total Processing & Packaging show, to be held at the NEC between the 25th and 27th May 2010.
Telsonic launched a new Packaging Technology Division in 2009 and the company’s stand at this year’s event will feature a number of modules and concepts, including new ultrasonic innovations, which are targeted specifically at sealing applications on flexible and rigid packaging. A key feature on the Telsonic stand this year is a demonstration of longitudinal Fin Sealing on packaging using Telsonic’s new torsional ultrasonic head principals. The equipment on show is equally suited to integration within VFFS or HFFS systems. The features, flexibility and reliability of the process, present benefits in a wide range of packaging and sealing applications.

Other concepts on display will include:-

• VFFS & HFFS cross sealing modules using multi converter systems
• Torsional welding of “peelable” foil lids to plastic or coated aluminium pots
• Rotary paddle cross sealing modules for VFFS & HFFS machines
• Multi-converter cross sealing for linear or rotary (impeller) applications for SUP (stand up pouches)
• Cut’n’Seal Technology

Telsonic UK Limited can be located on stand 5260, and company representatives will be happy to discuss customer applications and offer advice on the use and integration of Telsonic’s ultrasonic technology for all types of packaging, sealing and machine integration projects.

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