PA&E

PA&E Announces Lightweight Hermetic Receptacle for Souriau’s microComp

News Release from: PA&E
06/10/2009

Engineers who want to leverage Souriau's light-weight, high-density microComp connector line in harsh environment applications can now shave even more weight off their design without compromising hermetic integrity, following with the new aluminum compatible microComp hermetic receptacle from PA&E.

Souriau’s microComp connector line is well suited to any application that requires a light-weight, high-density rectangular connector. microComp connectors typically weigh 60% less and are 25% smaller than standard high-density Sub-D connectors. They can be built with as few as seven or as many as 104 contacts and have a contact pitch of 2.0 x 1.7 mm2. The microComp line comes in both space and military grade configurations and each connector offers dismountable contact construction for wiring flexibility.

The new aluminum compatible PA&E microComp hermetic receptacle is currently designed for the microComp 25-pin configuration and offers a weight savings of up to 40% when compared to stainless steel alternatives. It has a leak rate of less than 1X10-9 cc/sec helium at one atmospheric differential pressure thanks to PA&E’s Kryoflex® polycrystalline ceramic. Kryoflex-sealed connectors provide superior electrical performance -- up to 70 times the current-carrying capacity of conventional products -- while withstanding extreme mechanical and thermal stresses.

The microComp hermetic receptacle provides an insulation resistance of greater than 5,000 megohms at 500 VDC when tested in IAW MIL-STD 1344, Method 3003. It is built with beryllium copper alloy contacts that are finished in nickel/gold and has an operating temperature range of -55°C +170°C. The microComp receptacle is designed for aluminum, titanium or iron/nickel alloy applications and is available in laser-weldable or o-ring mount styles. These receptacle connectors are also available in a double-ended bulkhead configuration for applications requiring an interconnection on both sides.